WebThe present invention describes methods and chemical compositions for the spin etch planarization of surfaces, particularly copper and tantalum. An etching solution is brought into contact with the upper face of a spinning wafer through a nozzle, preferably an oscillating nozzle. The etching solution has a composition that oxidizes the spinning ... WebIn CMP processes, the mechanical forces play a dominant role. The present work describes an emerging method of planarization called “Spin-Etch Planarization” (SEP). This is a …

Metal-Insulator-Semiconductor Contacts, and Spin Coating

WebIn CMP processes, the mechanical forces play a dominant role. The present work describes an emerging method of planarization called “Spin-Etch Planarization” (SEP). This is a chemical approach involving no mechanical force. WebJul 1, 2003 · The present work describes the process principles of “Spin-Etch Planarization” (SEP), an emerging method of planarization of dual damascene copper interconnects. citibank indonesia ready credit

Progress in Spin-on Hard Mask Materials for Advanced Lithography

WebA photoinduced confined chemical etching system based on TiO2 nanotube arrays is developed for the planarization of the copper surface, which is proved to be a prospective stress-free chemical... WebCHECK THESE SAMPLES OF Metal-Insulator-Semiconductor Contacts, and Spin Coating Development of Pad Conditioner Drop Detection System spin etch planarization (SEP) 10 2.... spin on deposition (SOD) 11 SOP is mostly applied in deposits on different glasses, porous low-k dielectrics and polymer ILD.... WebSep 15, 1993 · A SOG/etch-back process has been developed in order to be compatible with a 0.5 micrometers triple level metal technology with plugged vias. Four SOG are compared in terms of planarization level after coating but also after etch-back. The etching process is studied in order to reach the low selectivities required to compensate the microloading … diaper bag with built in changing pad